The Myriad Alpha XI photoresist processing system is the result of a technological evolution. This generation embodies Myriad's most advanced technologies in photoresist processing designed to meet the needs of advanced lithography processes. Alpha XI features enhanced safety, simple one-axis pick and place handling and an advanced automation and control system. Designed with a flexible, modular construction, the Alpha XI can be configured for virtually any process requirement - quickly and easily. The powerful automation and control system provides a level of operational simplicity and process consistency not found in competitive systems. Alpha XI was designed with an emphasis in flexibility, maximum reliability and ease of service resulting in low cost of ownership.

The Alpha XI photoresist processing system provides modules for prime, coat, develop and bake processes. Each can be expanded and enhanced by implementing options such as fluid temperature control, optical topside resist removal and various closed chamber configurations including solvent enriched atmospheres. Basic cabinet sizes accommodate from 10 to 21 modular process positions. Modules can be configured for a wide range of process flows and external equipment interfaces. Wafer transport between process modules is accomplished by a simple, single-axis transport arm. The control system utilizes a central computer control, fiber-optic communication links, and distributed intelligence. This approach eliminates bulky wiring harnesses and offers unprecedented modular flexibility. Programming recipes is simple for even the most complex processes. Due to the hazardous materials often utilized in resist processing, special attention has been paid to operator safety through the use of safety interlocks, secondary containment.
 
 

Advanced Processing
All operations are controlled through a menu-driven, touch screen interface with multiple language capability. The software package includes diagnostics and on-line help screens. To accommodate factory automation and provide maximum process security, the software features real time parametric monitoring, data logging, safety interlocks and a full-featured host computer package. This allows for continuous monitoring and adjustment to ensure optimum results. 
Extensive diagnostics and 'Recipe Test' routines enhance productivity by reducing the time required to complete process development and maintenance tasks. Pertinent data and operational information are stored in the log for future analysis or process optimization.

Cassette Module                                                                           Wafer Handler

Clean Wafer Handling
The wafer transport system and process chamber are designed to provide reliable wafer handling with minimal particulate contamination. Wafers are moved from stationary cassettes via a vacuum pick-up-arm. Inter-module wafer handling is accomplished with a simple and reliable single axis transfer arm with backside contact only. All transfer arms are driven by brushless motors with positional feedback for precise repeatability and easy calibration. 
Calibration parameters are stored in non-volatile RAM with hard disk backup to ensure quick recovery in the event of a power loss or system reset. 

The transfer arm is also the key component in the Alpha XI's unique non-contact wafer positioning system. Wafer centering is accomplished with a unique 'measure/adjust' scheme that feature no wafer edge contact or backside abrasion, resulting in fewer particulates.
 

Process Control 
Process work has shown that variations in time between bake and the associated cooling step can result in significant shifts in critical dimensions. Unlike systems that utilize a 'next available' transfer or random access scheme, Alpha XI is designed to keep this source of process instability at an absolute minimum by ensuring consistent timing between process steps. 

Today's advanced lithography processes demand tight control of all process chamber parameters. The Alpha XI features enclosed chambers, Mass Flow Controller (MFC), tuned exhaust control and solvent enrichment to ensure optimum process performance and stability. Dedicated microprocessors in all modules provide real time control during processing to keep all dynamic parameters on their recipe setting.
 

Coat & Develop
Each Alpha XI process module is equipped with a fully programmable dispense arm, process tub with separated drain and exhaust and a pumped waste collection system. The servo controlled dispense arm is under recipe control to dispense chemicals at a single point, at multiple points or following various radial patterns to accommodate any process requirement. The programmable 'Z' axis capability sets the desired nozzle height above the wafer when dispensing. 
A variety of coating options are supported including; process fluid temperature control, solvent enriched atmospheres and topside resist removal. 

The developer can be configured for ambient or controlled temperature spray, puddle, or ultrasonic dispense and accommodates single or multiple developer solutions.

Process Module                                                                           Hot/Cool/Prime Module

Hot/Cool/Prime 
One basic module has been designed for a wide range of bake, cool, and various active processes including prime. The Bake Module provides a large thermal mass for stable and uniform bakes at all temperatures including the high temperatures required for dehydration bakes or curing spin-on-films and dopants. Proximity baking plays a key role in the reduction of backside particle transfer. Alpha XI bake modules provide three-point wafer support with brushless servo motors for accurate and repeatable multiple level proximity baking. 
The Cool Module is designed to allow maximum throughput and process control while minimizing thermal shock to the substrate. 

When equipped with a closed chamber and process gas unit, the hot or cool module is well suited for elevated or ambient temperature vapor prime processes.
 

Factory Automation 
As feature sizes decrease, the integration of various production tools into process-linked 'lithography cells' is becoming more common. Simultaneously, factory automation is improving productivity by reducing particulate generation and process related errors. Alpha XI comes with a full-featured SECS II software package designed to interface to a wide range of external equipment including exposure systems, inspection tools, host computer equipment, process monitors, environmental enclosures and SMIF systems. 
 

Designed For Safety
Alpha XI is built to rigorous safety, component reliability, and compliance testing standards including IEC, NFPA, UL, SEMI, and TUV. Chemical areas are exhausted and surrounded by secondary containment. Process areas are equipped with interlocked safety covers and enclosed chambers to contain solvent fumes during processing. In addition, explosion proofing has been implemented in hazardous chemical areas, and all electrical areas are purged and interlocked. 
 

Cost Of Ownership 
The Alpha XI includes features specifically targeted to keep cost factors low. It has a small footprint yet maintains a very competitive throughput. The software is designed to keep setup and process qualification times to a minimum by incorporating 'Recipe Test' modes which allow the user to edit module recipes individually or in small groups. Real time computer control of all process functions (i.e. dispense arm, spindle motor, fluid temperature and flow) ensures stable processing and minimal chemical consumption. 
 

Reliability By Design
Alpha XI uses a minimum of moving parts for a simple yet efficient design. The conventional mechanical wafer centering scheme with its associated adjustments has been replaced with a hands-off computer controlled centering system. Spin motor and hot plate temperature controls are self-calibrating, and the wafer transport system requires a one time calibration only. Process qualification and maintenance times are minimized through the use of menu driven diagnostics, 'Recipe Test' modes, data logging and extensive 'Help' capabilities. Maximum reliability is assured by extensive modules system level testing. All prototype assemblies have undergone cycle testing equivalent to many years of production.